会议专题

The 12th China-Japan International Conference on Ultra-Precision Machining Processes (CJUMP 2016) (第十二届中日超精密加工国际会议)

总文献量: 30篇会议类型: 国际会议会议地点: 长沙主办单位: 中国机械工程学会会议日期: 2016-11-04

文章浏览

A Simulation Analyze of Abrasive Jet Polishing Based on Negative Pressure Cavitation Effect

Fengjun Chen Yu Tang Shaohui Yin

Simulation and Experiment for Micro-surface Topography in Pre-stressed Dry Grinding Process

zz Yushi WANG Minghe LIU Wanli SONG Shichao XIU

Precision Deterministic Processing Algorithm under W-shape Removal Function of FJP

Zongfu Guo Tan Jin Ange Lu Meina Qu

Numerical Simulation of Friction-reduction Effect of Micro-textured Surface in Hydrodynamic Lubrication

Yue SUN Chihiro KATOU Shaolin XU Keita SHIMADA Masayoshi MIZUTANI Tsunemoto KURIYAGAWA

Error Analysis of Radial Error Motion Measurement of Ultra-precision Axis of Rotation

Qiang Shu Qiu Hu

A Novel Research about Fluid Hydrodynamic Fixed Abrasive Grinding based on Small Tool

Pengfei Liu Bin Lin

Magnetic Polishing of Stainless Steel with Machining Center

Tatsuya Furuki Toshiki Hirogaki Eiichi Aoyama

Fine Finishing of SUS304 Stainless Steel by Low-Frequency Alternating Magnetic Field-Assisted Polishing

Jinzhong Wu Yanhua Zou

Experimental investigation of water-lubricated ceramic hydrostatic spindle

Shuai Yan Bin Lin Xiaofeng Zhang

Manufacturing Process of KDP Crystal by IBF Technology

Furen Li Xuhui Xie Lin Zhou

Biomachining Properties of Pure Copper and Powder Sintering Metal by Microorganisms

Fei Ma Hui Huang

Achieve Infrared Performance of Large Sized Aspheical Lens via Ultra-precision Grinding

Qingliang Zhao Bing Guo Bing Chen

Computational Fluid Dynamics Simulation of Internal-Circulation Abrasive Flow Polishing

Xiao Liu Peng Yao Xiong Li Chuanzhen Huang

Development of the Electric Rust Preventive Machining Method System-Ultra-Precision Machining and Sustainable Development with Clean Water Machining for Future Green Factory

Naohiro Nishikawa Takekazu Sawa Nobuhito Yoshihara Yoshihiro Hagihara Hiroaki Okawai Masahiro Mizuno Shinya Tsukamoto

Hydrodynamic Simulation of Abrasive Flow Surface Polishing

Xiong Li Peng Yao Xiao Liu Chuanzhen Huang

Study on Crack-induced Cutting of Silicon Using Micro-indentation Array

Long Zhang Jin Xie RuiBin Guo

Investigation of the influence and characterization for silicon wafer dicing process

Shaohui Yin Junxiao Geng Hongliang Yang Weijie Yuan

Investigation of parameters influence on the material removal during electrochemical mechanical polishing of stainless steel substrate

Kehua Zhang Miaomiao Zhu Zhilan Xiao

New figuring model based on surface slope profiles

Lin Zhou Yong Li

High-precision Grooving of CFRP by Ultrasonic Vibration-assisted Grinding

Takeshi Yamasaki Jiwang Yan