Study on Crack-induced Cutting of Silicon Using Micro-indentation Array
In this paper, a crack-induced cutting method was proposed to cutting Si using micro-indentation array.The objective is to realize the crack-induced cutting of Si with zero material removal.First, the experiment of Vickers-indentation and indentation intervals different distance on Si surface were achieved.Then the crack-induced cutting experiments was performed along with micro-indentation array.Finally, cutting force, form errors and surface roughness were investigated.It is shown that the observable micro-crack was generation at Vickers-indentation load 0.1~0.5 N, and the length of micro-crack increases with increasing loading force;It is confirmed that the crack-induced cutting with 1 ms and less produces, the cutting force of 1.5N, the cut form errors of 22.5 μm/mm and the cut surface roughness of 36 nm.
crack-induced cutting micro-crack crack propagation Vickers-indention silicon
Long Zhang Jin Xie RuiBin Guo
School of Mechanical & Automotive Engineering, South China University of Technology Guangzhou 510640, China
国际会议
长沙
英文
156-161
2016-11-04（万方平台首次上网日期，不代表论文的发表时间）