Investigation of the influence and characterization for silicon wafer dicing process

摘要：

　　Silicon wafers have been widely used as substrate materials in the semiconductor industry and micro electro-mechanical systems (MEMS).Silicon wafers are singulated into individual chips after device processing and before packaging.The street width of the component structures must to be kept at a minimum, which keeping the wafer surface available for integrated circuits or MEMS devices.The standard way to dice a semiconductor wafer is blade cutting.So the important thing is to minimize edge chipping and reduce the dicing blade width.Furthermore, the dicing process may induce subsurface damages and micro-cracks.important thing is to minimize edge chipping and reduce the dicing blade width.

关键词： Diamond blade Silicon wafer Chipping Dicing

作者: Shaohui Yin Junxiao Geng Hongliang Yang Weijie Yuan

作者单位: National Engineering Research Centre for High Efficiency Grinding, Hunan University Changsha 410082, National Engineering Research Centre for High Efficiency Grinding, Hunan University Changsha 410082,

会议类型: 国际会议

会议名称: The 12th China-Japan International Conference on Ultra-Precision Machining Processes (CJUMP 2016) (第十二届中日超精密加工国际会议)

会议地点: 长沙

会议语种:英文

页码: 145-149

在线出版日期: 2016-11-04（万方平台首次上网日期，不代表论文的发表时间）