会议专题

第十一届世界电子电路大会

总文献量: 126篇会议类型: 国际会议会议地点: 上海主办单位: 中国印制电路行业协会会议日期: 2008-03-17

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Advanced Design for Fine Pitch BGAs to Minimize Layer Count

Flemming Boisen

PCB Transplanting Technology Study

Chen Zhiyu

The Challenges of Higher Temperature Lead Free Process --An Introduction to Laminates with Higher Heat Resistance and Reliability

Peter Liang

Stress of Electroless Copper Deposition–Measurement and Effects on Quality of the Deposited Layer

P.Heptner F.Brüning

Flexible Circuits for Sustainable Electronics

Hidetaka Hayashi

How to Comply With the RoHS Directive

Chen Xiaoyan Li Ru

A study on the additive effect on the anisotropic etching for fine pattern formation

Younggeun Park Min Soo Kim Lee Jung Han Soon Jin Cho Chang Seop Ryoo

HDI Semi-Flex PCBs Providing New Miniaturization Solution Alternatives

Tarja Rapala-Virtanen Timo Jokela

Surface Finish of Electroplating Copper/Lead-free Solder on IC substrate

Weihung Lin Wenhung Hu YingChih Chan Hungsheng Hu Shih-Ping Hsu

Design and Manufacture of Embedded Resistor and Embedded Capacitor in PCB

Chen Yuchao Xi Zhaohui Zhu Zhanzhi

Effect of Electroless Nickel Alloy Films as Intermediate layer on Au/Ni-P Films

Ichiro Koiwa Yohei Wakuta Takeshi Muramatsu Hideto Watanabe Hideo Honma

Copper Activation in PCB Fabrication Using Environmentally Friendly Process and Technology

Jürgen Schmidt Peter Amann

Technology of copper plating for through via filling

Hiroshi Ishizuka

Non Linear Regression Analysis of Technological Parameters of the Plasma Desmear Process for Rigid-Flex PCB

He Wei Cui Hao Wang Shouxun He Bo Hu Ke Guan Jian Xu Songlun Wang Yang

Investigation on Reliability of Halogen-Free Materials for Lead-Free Assembly

Li-chun Chen Jeng-I Chen

What is Consideration When we are Selecting Pb Free Compatible Material?

Jin-Ho, Lee

Interconnection Technology for Rigid to Flex

Kohichiro Kawate

Physical Recycling and Comprehensive Utilization Technology of Abandoned Printed Circuit Boards

Ming Guoying

All Layer IVH Structure Substrate Using Organic Film

Shogo HIRAI Fumio ECHIGO

On Expansion and Shrinkage of Thick Copper Clad Printed Circuit Board

Liu Min