HDI Semi-Flex PCBs Providing New Miniaturization Solution Alternatives
The continuous increase in the functionality and integration level of electronics products drives the PCB technology and makes the demand for new innovations obvious. The component pitch size reduction with high I/O count means higher resolution and improved high frequency properties in the PCB level. It is challenging to meet all the new targets using conventional HDI printed circuit board technologies-new reliable technologies are needed. Simultaneously with the requirement of the higher resolution the PCBtechnology has to offer more flexibility to the designers allowing them to effectively utilize space inside the electronic devices. In order to achieve this goal different flexible PCB solutions are needed. The market of Rigid-Flex PCBs is growing fast due to its advantages in all market segments. As a fabricator for rigid PCBs there are challenges in the production to adopt the new industry requirements. In this paper, it will be explained how the goals have been met to manufacture Rigid Flex PCBs using new materials and process combinations but utilizing the standard rigid PCB equipment. Also the manufacturing cost must be competitive to fulfill the customer satisfaction together with the demand of the size and performance.
Tarja Rapala-Virtanen Timo Jokela
Aspocomp Finland
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）