Technology of copper plating for through via filling
With downsizing of electronic devices in recent years, the interconnections in the build-up PWBs used for those devices are becoming denser and finer. In addition, cost reduction is strongly desired as the production volume grows. In the effort of meeting those requirements, we have been working on the process to fill the through holes in the core layer of the build-up PWBs with copper plating. Use of the process allows not only filling of smaller through holes but also formation of thinner films, subsequently allowing formation of line patterns in more fine pitches. Further, improvement in productivity and reduction in cost are also expected by drastic reduction in the number of production steps. In this paper, the relation between the results of our electro-chemical measurement and the features of additives that has become known as a result of our investigation are reported as well as various experimental data on the through via filling process we developed.
Hiroshi Ishizuka
EBARA-UDYLITE CO.,LTD. 4-3 Kurigi 2-Chome,Asao-ku Kawasaki-shi,Kanagawa pref,JAPAN
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）