Stress of Electroless Copper Deposition–Measurement and Effects on Quality of the Deposited Layer

摘要：

Introduction:Electroless Copper deposition has been used for some decades on a wide scale to deposit a conductive layer on insulators such as epoxy resin which is widely used in PCB manufacturing. From a production point-ofview, one interesting factor among many others like crystal grain structure, conductivity or ductility to judge the quality of a deposited electroless Cu film is the internal stress. Desirable physical characteristics of the film will lead to a production process that does not create surface blisters on exposed resin areas or blistering in drilled holes (hole wall-pull away phenomena).

作者: P.Heptner F.Brüning

作者单位: Atotech Deutschland GmbH Berlin Germany

会议类型: 国际会议

会议名称: 第十一届世界电子电路大会

会议地点: 上海

会议语种:英文

在线出版日期: 2008-03-17（万方平台首次上网日期，不代表论文的发表时间）