What is Consideration When we are Selecting Pb Free Compatible Material?
There are several stringent requirements for PCBs when switching to Pb free assembly.First, all of these boards must survive(No delam.) the increased thermal stress of repeated Pb free assembly cycles which has 260 peak temperature. ℃ Non-Dicy cured High Tg material can more endure higher temperature than dicy cured material generally.However, changing material is not enough to solve the issue. Secondly, the reliability of PCBs after assembly shall be equal or better compared to those boards assembled with SnPb assembly.
Jin-Ho, Lee
ISU PETASYS Co.,Ltd Dae-Gu,South Korea
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）