Non Linear Regression Analysis of Technological Parameters of the Plasma Desmear Process for Rigid-Flex PCB

摘要：

The plasma desmear process is one of the crucial problems in the manufacture of rigid-flex printed circuit boards (PCB). The technological parameters of the plasma desmear process for rigid-flex PCBs were optimized by an orthogonal experiment design (OED). Minitab Statistical Analysis Software was used to obtain a nonlinear regression analysis for the data obtained from the orthogonal experiment. Prediction and control for production had been realized by the regression equation. A four-layer high density interconnect (HDI) rigid-flex PCB was developed successfully and the qualification rate reached 92％ under the optimum conditions for the plasma desmear process.

关键词： Printed circuit boards (PCB) high-density interconnects (HDI) rigid-flex PCB plasma desmear nonlinear regression analysis orthogonal experimental design

作者: He Wei Cui Hao Wang Shouxun He Bo Hu Ke Guan Jian Xu Songlun Wang Yang

作者单位: State key Laboratory of Electronic Thin Films and Integrated Devices,University of Electronic Scienc Zhuhai Topsun Electric Technology Co., Ltd.Xianzhou Science and Technology Industrial Park, Zhuhai, The Research and Analysis Center (RAC) of China CEPREI Lab, No.110, Dongguanzhuang Rd,Tianhe Distric

会议类型: 国际会议

会议名称: 第十一届世界电子电路大会

会议地点: 上海

会议语种:英文

在线出版日期: 2008-03-17（万方平台首次上网日期，不代表论文的发表时间）