Investigation on Reliability of Halogen-Free Materials for Lead-Free Assembly
Three halogen-free materials, IT140G, IT155G, and IT170GR, were studied for their property and compatibility with lead-free assembly process. The material performance was compared with standard FR-4. Laminate properties were investigated, such as Tg, CTE (thermal expansion), Td (decomposition temperature), T-288 (time-to-delamination), and peeling strength. Various PCB test coupons were prepared for reliability tests, such as TCT (thermal cycling), CAF (conductive anodic filament), and thermal stress test. It was found that these halogen-free materials showed lower thermal expansion and better thermal resistance. Moreover, results from the reliability tests on PCB coupons showed that the halogen-free materials exhibited excellent reliability.
Li-chun Chen Jeng-I Chen
ITEQ Corporation Taoyuan,Taiwan
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）