Advanced Design for Fine Pitch BGAs to Minimize Layer Count

摘要：

The reduction in pitch size increases the micro-via-layer count for HDI PCBs. By optimizing the design, significant layer reduction can be achieved. However, the PCB technology becomes more demanding. PCB fabricators are not always willing to follow the miniaturization route but advanced electronic components need the advanced design for best functionality of the electronic devices and last but not least the lowest cost.

作者: Flemming Boisen

作者单位: PCB Design and technology Wireless Terminal Business Unit Texas Instruments Denmark A/S Sofiendalsvej 93,DK-9200 Aalborg SV,Denmark

会议类型: 国际会议

会议名称: 第十一届世界电子电路大会

会议地点: 上海

会议语种:英文

在线出版日期: 2008-03-17（万方平台首次上网日期，不代表论文的发表时间）