On Expansion and Shrinkage of Thick Copper Clad Printed Circuit Board
The production of thick copper clad printed circle board is raising and the requirement is stricter and stricter as the increasing of market demand to high-powered component such as electrical source modules. As we know expansion and shrink is a significant factor that impacts on the quality during the production of heavy copper printed circle board. This paper finds out the critical factor that can cause expansion and shrink from analyzing various values of expansion and shrink under different manufacture technique by using statistical methods, and then the idea of technological parameter optimization is introduced in order to make sure the quality of thick copper printed circle board is more stable and reliable.
expansion and shrinkage thick copper printed circuit board
Liu Min
Shenzhen King Brother PCB Technology Co.,Ltd.Guangdong China
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）