Copper Activation in PCB Fabrication Using Environmentally Friendly Process and Technology
Sodium persulphate is often used as a standard product in activation of Copper surfaces in PCB fabrication. However, this persulphate technology is difficult to control, maintain and to replenish within the process. In addition, the etching rate is not very even over time. Depending on the type of contamination type and the level of oxidation, the copper structure of the processed surface may show an uneven roughness. The paper will explain how the European PCB industry have recognized a solution by implementing a newchemistry system. This system allows to be used in existing equipment and adapted for new processrequirements, how a control system is used to control the total equipment and the chemistry to maintain aconstantly stable process. The PCB fabricator will get an even metallurgical surface structure after the pre-etchthat provides an optimum base for the following processes, like plating, laminating of liquid-or dry film resistor black oxide treatment. As a result, the technology will permit for higher yields as well as allowing for anenvironmentally friendly process, a reduced amount of the chemistry is used in a very well balanced processthat is easier to replenish and to dispose if needed.
Jürgen Schmidt Peter Amann
KIV PCB ProfiChem GmbH Ober der Mühle 30 42699 Solingen,Germany
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）