会议专题

China's Premier SMT & MPT Event(2007年中国国际表面贴装和微组装技术大会)

总文献量: 26篇会议类型: 国际会议会议地点: 上海主办单位: 上海科技开发交流中心会议日期: 2007-03-22

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Printed Circuit Boards In Micro Fluidic Applications

Stefan Gassmann Lienhard Pagel

Highlights of the 2007 iNEMI Roadmap

Robert C.Pfahl Charles Richardson James McElroy, Sr.

MEMS Sensors for Automotive and Consumer Applications

Von Janecek, Hubertus

Electroless Nickel/Gold-Practical aspects of Black Pad -free and High Sophisticated Lead-Free Surfaces for solder and Wirebonding Applications

Bernd Endres

Lead Free Soldering and Process Window and BGA Crack Analysis

David Chen

High Density, Miniaturization, Integration Challenge and Opportunities for Future PCBs

Hannes Voraberger Markus Riester

Pre-plated NiPdAu-A Feasible Pb-Free Finish for Ics

X.J.Zhao J.F.J.M.Caers

Low-Cost High-Speed Assembly of Thin/Lightweight Components Including Bare Die

Ken Ball Charles Gutentag

The Development of PCB for the Next Decade

Wolfgang Scheel

Electronics Product Miniaturization and Impact on the Supply Chain

Dongkai Shangguan

Material Properties of Stainless Steel: What does It mean for Stencil Manufacturers?

A.C.Fischer C.H.Mahn

01005 Capability The 01005 Process within the Entire Production System

Norbert Heilmann Wang Qiongan

Properties and Soldering Behaviour of a Eutectic SnZn Solder Alloy

J.Villain U.Corradi Chr.Weippert

Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead

Weiping Liu Ning-Cheng Lee

Conducive Adhesive as a Lead Free Solution

Alexander Brand Thomas Krebs Hans-Werner Hagedorn

Analyses on Chinas SMT Automatic Chip Mounter Market

Jin Cunzhong

Successful Lead-Free Implementation: Pre-Conditions and Status

Albrecht, Hans-Jürgen

Conformal Coatings and their Increasing Importance for a Safe Operation of Electronic Assemblies

Manfred Suppa

Solder Joints for High Temperature Applications

Mathias Nowottnick

Critical Design Factors Analysis to the Reliability of High Aspect Ratio PTH

Zhang Yuan