The Development of PCB for the Next Decade
Todays technical level of Printed Circuit Assemblies (PCA) characterizes the quality of electronic systems. The driving force for the steady improvement of PCAs in functionalism and complexity has been the continuous innovation in the semiconductor industry. Accordingly, different packaging generations for devices with a broad application spectrum are applied in PCA-production today. In order to be able to interconnect these packaging generations to PCAs, a continuous development of the Printed Circuit Board (PCB) design has been necessary. Even stronger system integration will elaborate the PCB into an active system platform in the future. Innovation is still going strong: New technologies e.g. micro-system technology will have to be employed to reach this goal. The development of the PCB from the beginning until today with its future potential in functionality, complexity and miniaturization necessitates a fundamental change of the PCB production chain.
printed circuit board multifunctional board history future trends
Wolfgang Scheel
Fraunhofer IZM Head of Department Module Integration and Board Interconnection Technologies Gustav-Meyer-Allee 25, D-13355 Berlin, GERMANY
国际会议
Chinas Premier SMT & MPT Event(2007年中国国际表面贴装和微组装技术大会)
上海
英文
248-255
2007-03-22（万方平台首次上网日期，不代表论文的发表时间）