Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn, Bi, Ti, Ce, and to a less extent Y for SAC 105 have been observed to show very positive effect when used alone or in combination, with Mn exhibiting the most profound effect. SAC+Mn outperformed not only SAC alloys, but also Sn63, thus completely altered the shaky position of SAC systems caused by fragility of solder joints. The melting and intermetallic formation properties are not affected by the dopants. Mn tends to migrate toward IMC and accumulate near IMC layer in the form of MnSn, particles. Thermal aging results in further improvement of drop test performance.
lead-free SnAgCu SAC solder drop test fragility reliability.
Weiping Liu Ning-Cheng Lee
Indium Corporation of America Utica, NY
国际会议
Chinas Premier SMT & MPT Event(2007年中国国际表面贴装和微组装技术大会)
上海
英文
203-219
2007-03-22（万方平台首次上网日期，不代表论文的发表时间）