Properties and Soldering Behaviour of a Eutectic SnZn Solder Alloy
Tensile and creep tests of a eutectic SnZn alloy give information about the mechanical properties of the solder also compared to tin-silver and SAC-alloys (SAC tin/silver/copper-alloys). It can be observed that the strength of the tin-zinc solder material is higher than the strength of lead-containing and other investigated lead-free solder materials. It shows also a higher creep resistance than SnPb alloys. Micro/nano hardness measurements give hints to the interpretation of the strength behaviour. During the reflow soldering process and especially in the wave soldering process higher temperatures are necessary to achieve a good wettability and solder joints with high reliability. The tinzinc solder alloys show a dull finish and the solder joints a high strength after the soldering process but a higher decrease of strength after temperature cycles than the other tested alloys. However, the critical strength will never fall below a critical value. The tested corrosion behaviour was satisfactory. Metallographic cross sections give information about the structure in comparison to other lead-free solder alloys. Sometimes Au-layers were not totally solved in the solder. Tin-zinc solder alloys can be used in electronics if the tests show a good reliability, in contradiction to hints in the literature.
Lead free solder alloys eutectic SnZn solder reliability reflow soldering,Wave soldering nano hardness
J.Villain U.Corradi Chr.Weippert
University of Applied Sciences Augsburg Baumgartnerstr.16 86161 Augsburg Germany
国际会议
Chinas Premier SMT & MPT Event(2007年中国国际表面贴装和微组装技术大会)
上海
英文
13-22
2007-03-22（万方平台首次上网日期，不代表论文的发表时间）