High Density, Miniaturization, Integration Challenge and Opportunities for Future PCBs
The printed circuit board (PCB) and the way it is produced today have not changed to a considerable degree in the past 60 years. The state of the art is remains to etch the circuit design into a thin layer of pure copper. The biggest change of recent years in the design of printed circuit boards has been the introduction of High Density Integration (HDI) technology at the end of the 1990s. Laser drilling technology was introduced on a large scale for drilling through one layer to the next, which led to a significant reduction in the space requirements for vertical electrical connections. He trends in miniaturization, structuring and packaging techniques and also the reduction in the size of electrical and electronic components were mainly driven by the telecommunications industry. The next steps in the miniaturization of electronic structures for mobile consumer devices create new challenges for integration techniques because, in addition to miniaturization, a higher performance capacity for the systems is also needed. As a result there are new demands for functional materials, performance density in smaller and smaller components and the physical properties of the underlying materials. In the following the components and processes that have to be realized for an electrical system based on printed circuit board technology are sketched.
printed circuit board embedding components
Hannes Voraberger Markus Riester
AT&S (China) Co., Ltd., No.5000, Jin Du Road Shanghai 201108, PR China AT&SAG, Fabriksgasse 13, 8700 Leoben, Austria (HQ)
国际会议
Chinas Premier SMT & MPT Event(2007年中国国际表面贴装和微组装技术大会)
上海
英文
74-88
2007-03-22（万方平台首次上网日期，不代表论文的发表时间）