Pre-plated NiPdAu-A Feasible Pb-Free Finish for Ics
With the deadline for implementation of the RoHS and WEEE from the European Council and China government in July 2006 and March 2007 respectively, the push from semiconductor industry for lead-free products has been stronger than ever. More and more effort has been put globally to find feasible Pb-free solutions to replace the traditional lead-based packages. Looking for a suitable Pb-free finish in integrated circuits is one of these efforts. After a series of studies, pre-plated NfPdAu finish on IC leads is selected as one attractive alternative to pure Sn to replace the tin/Lead (Sn/Pb) plating and some ICs have been released with this type of finish. Before that, some evaluation was done to demonstrate the feasibility of those ICs with the finish in board assembly. Especially in soldering performance, solder joints strength under thermal loading, mechanical pull and vibration. In addition, the corrosion insulation of the component with pre-plated lead frame is also one of the evaluating points. Results of the evaluation show that all assemblies withstand the vibration test, the bump test and 3000 T-cycles between 20C and +100C. After exposure to a mixed gas environment creep corrosion is observed for all the components with the Pre-plated NiPdAu finish. The amount of corrosion products formed, however, is not enough to cause a decrease in insulation resistance between adjacent leads.
Pre-plated leadframes NiPdAu Pb-free Finish.
X.J.Zhao J.F.J.M.Caers
Philips Electronics, Philips Applied Technologies (App Tech) 620A Lrongl ToaPayoh Singapore 310153
国际会议
Chinas Premier SMT & MPT Event(2007年中国国际表面贴装和微组装技术大会)
上海
英文
118-133
2007-03-22（万方平台首次上网日期，不代表论文的发表时间）