Solder Joints for High Temperature Applications
The application of electronic assemblies is moving more and more in the high temperature range. For instance electronic units in the car near the engine have to work for 150□C ambient temperature and more. Because these temperatures are too high for common soft solder joints, the development of new materials and technologies is required. For the temperature region up to 150□C is the use of special reacting solders, a mixture of different alloys, possible. The situation for operating temperatures in the region of 200℃ is completely different. For these applications normally solder alloys with a high lead content are preferred. Lead-free solder alloys with comparable melting temperatures are not announced today. A new alternative can be the combination of adhesive joints with solder joints, whereas the mechanical function will be realized mainly by the adhesive. In contrast the solder joints can operate even in the liquid state, whereby the mechanical stress in the components hardly disappears. Low melting solder alloys are preferred especially for such liquid solder joints. Beside of the solder joints itself, the interfaces and components metallizations are also the subject of investigation for high temperature applications, because the intermetalltic growth and diffusion processes will be accelerated with increasing temperatures.
high temperature electronics solder joints reacting solders liquid solders
Mathias Nowottnick
University of Rostock Faculty Computer Science and Electrical Engineering Chair of Electronic Systems Reliability and Safety Albert-Einstein-Strasse 2 D-18059 Rostock, Germany
国际会议
Chinas Premier SMT & MPT Event(2007年中国国际表面贴装和微组装技术大会)
上海
英文
291-302
2007-03-22（万方平台首次上网日期，不代表论文的发表时间）