Low-Cost High-Speed Assembly of Thin/Lightweight Components Including Bare Die

摘要：

This paper describes the development of tape & reel materials for Bare Die from the 1970s through to the present day, including the pros and cons of the different forms of carrier tape available. A discussion about some of the more difficult to handle components is included. As the percentage of bare die in electronics products continue to increase, together with thinner and smaller die, the assembly industry requires a more efficient, more accurate and more effective means of delivering die to high-speed assembly machines. This paper goes on to describe the characteristics required of a low-cost high-speed packing system and present the advances that Tempo Electronics have recently made to provide an optimum carrier tape.

关键词： Bare Die tape & reel packing packaging flip-chip carrier tape

作者: Ken Ball Charles Gutentag

作者单位: Tempo Electronics, North Hollywood, California, USA

会议类型: 国际会议

会议名称: Chinas Premier SMT & MPT Event(2007年中国国际表面贴装和微组装技术大会)

会议地点: 上海

会议语种:英文

页码: 53-60

在线出版日期: 2007-03-22（万方平台首次上网日期，不代表论文的发表时间）