会议专题

2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

总文献量: 271篇会议类型: 国际会议会议地点: 上海主办单位: 中国电子学会;中国半导体行业协会;上海大学会议日期: 2011-08-08

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Fabrication of Integrated Microwave Passive Devices Using Thick BCB as Dielectric at Wafer Level

Jiajie Tang Xiao Chen Xiaowei Sun Le Luo

Simulation for the Contact Resistance of a Single Anisotropic Conductive Adhesive Particle with Rough Surface

Xiancai Chen Bo Tao Zhouping Yin

Effects of Grooves Substrate on Thermal Interface for the LED Module

Tao Peng Mingxiang Chen Xiaogang Liu Xiaobing Luo Sheng Liu

Recent Progress in The Studies of Low Melting Sn-Based Pb-Free Solders

Yang Lin Luqiao Yin Xicheng Wei

Improvement of the Second Bond Strength in Copper Wire Bonding on Pre-Plated Leadframe

Bing An Lan Ding Techun Wang Tailieh Lu Liangquan Sun Yiping Wu

Irregular Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0RE Solder Joints

Hu Hao Jun Tian Guangchen Xu Fu Guo Yonglun Song Yaowu Shi

3D Modeling and Electrical Characteristics of Through-Silicon-Via (TSV) in 3D Integrated Circuits

Lei Liang Min Miao Zhensong Li Shufang Xu Yuexia Zhang Xiaoqing Zhang

Application of Silicon Stress Sensor in Flip Chip Packaging System

Chengjie Jiang Fei Xiao Heng Yang Chuanguo Dou

The Impact of Wire Bonding on the Transmission Performance of High-Speed Links in SiP

Yang Kun Gao Wei li Zhihua Wan Lixi

Application of Response Surface Methods in Lead-free Solder Joints of Plastic Ball Grid Array Thermal Fatigue Life Prediction

Zhao Qiang Dejian Zhou

A Numerical Method on Thermal-humidity Behavior of Electronic Packaging

Yue Mei Xiaohu Yao

FE Simulation of Joint Volume Effect on Fracture Behavior of BGA Structure Cu/Sn3.0Ag0.5Cu/Cu Interconnects under Lap-shear Loading

Xia Jian-Min Li Xun-Ping Ma Xiao Zhang Xin-Ping

Preparation and application rod-shaped and spherical silver nanoparticles

Jinting Jiu Takehiro Tokuno Masaya Nogi Katsuaki Suganuma

Effects of Plating Parameters on the Au-Sn Co-electrodepositon for Flip Chip-LED Bumps

Jianling Pan Mingliang Huang Song Pan

The Effect of Polyethylene Glycols upon Copper Electrodeposition in Methanesulfonate Electrolytes

Chunhua Ji Huiqin Ling Ming Li Dali Mao

LED Packaging Study by Tear-down Approaching

T.ONISHI

Improved Humidity Resistance of Leaded Packages through Solder Dip Process

Yeoh Lai Seng Law Che Seong Ng Eng Keat Gooi Boon Hooi Francis Classe Susan Li

The Influence of Electromigration and Aging on the Reliability of SnAgCu Lead-Free Solder Joint at 100C

Guoqiang Wei Jian Yao Yonghua Shi

Interfacial Reaction Between the Thermopile Materials and Eutectic Sn-Based Solders

Li Shen Guangchen Xu Ran Zhao Fu Guo

3D Modeling and Simulation of Heat Transfer for Internal Channel Cooling of 3D-Chip Stacks

Jing Zhang Daniel Guidotti Xueping Guo Jing Zhou Liqiang Cao Daquan Yu Lixi Wan