会议专题

2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

总文献量: 271篇会议类型: 国际会议会议地点: 上海主办单位: 中国电子学会;中国半导体行业协会;上海大学会议日期: 2011-08-08

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Nanoprecision Aligned Wafer Direct Bonding and Its Outlook

Chenxi Wang Tadatomo Suga

Employment of Sputtered Ni-Zn Films for Under Bump Metallization with Sn-3.0Ag-0.5Cu Solder Attached during Liquid Reactions

Hsiu-Min Lin Jenq-Gong Duh Su-Yueh Tsai

Effect of Al2O3 Addition in Sn-Ag-Cu Solder Balls on the Microstructure and Shearing Strength of BGA Packages with Immersion Sn Surface Finish

T.H.Cheng L.C.Tsao F.S.Wang W.Y.Kuo

Chip-on-board (COB) Wafer Level Packaging of LEDs Using Silicon Substrates and Chemical Foaming Process(CFP)-made Glass-bubble Caps

Hui Yu Jintang Shang Chao Xu Xinhu Luo Jingdong Liu Li Zhang Chiming Lai

Improving Plated Copper Adhesion for Metallisation of Glass PCBs

Baofeng He Dennis Patrick Webb Jon Petzing Richard Leach

Effects of YAG: Ce Phosphor Particle Size on Optical Performance of White LEDs

Zong-Yuan Liu Cheng Li Bin-Hai Yu Yao-Hao Wang Sheng Liu Han-Ben Niu

Development of a Three-dimensional Integrated Solder Ball Bumping & Bonding Method for MEMS Devices

Lei Yang Wei Liu Chunqing Wang Yanhong Tian

Polymer Nanocomposites for Screen Printed Electronic Connections

Kamil Janeczek Aneta Arazna Konrad Futera Grazyna Kozio Malgorzata Jakubowska Anna Mloxniak Wojciech Steplewski

Discoloration Mechanism of Silver-filled Adhesive used for Packaging Solder Joint

Zhenzhen Rao Shengxiang Bao Weiming Lai Guanghua Shi Peng Li Jianhai Ye

A Study on The Low Temperature Sintering-Bonding through In-Situ Formation of Ag Nanoparticles Using Ag2O Microparticles

Fengwen Mu Guisheng Zou Jianfeng Yan Hailin Bai Aiping Wu

Effect of LaNiO3 Electrode on Crystallization of BaTiO3 Thin Films for Capacitors Prepared by Solgel Technique

Bin Li Chunqing Wang Weiwei Wu Wei Zhang Ying Zhong

Formic Acid Vapor Treated Cu-Cu Direct Bonding at Low Temperature

Wenhua Yang Hiroyuki Shintani Masatake Akaike Tadatomo Suga

Effect of Thermal Shock Profile on solder joint of WLCSP

RongHua Hong Jun Wang

Study into the Application of Single-Wall Carbon Nanotubes in Isotropic Conductive Adhesives

Dongsheng Li Huiwang Cui Qiong Fan Yajun Duan Zhichao Yuan Lilei Ye Johan Liu

Experiments and Numerical Simulation on the Performance of LED Subjected to Thermal Shock

Xulong Gui Sheng Liu

Effect of Substrate Surface Treatment on the Bondability of Wire Bonding

Lingwen KONG

Advanced Epoxy Molding Compound Technology & Marketing Trend

Tom XIE

In Situ Measurement of Stress Evolution in Sn-Based Solder Joint under Electromigration Based on X-ray Diffraction Technique

Hongwen He Haiyan Zhao Limin Ma Guangchen Xu Fu Guo

Design and Reliability of Power Electronics Modules

Hua LU

Mechanical Testing and Analysis of Polymer Based Flexible Solar Cell and Full Cell Packaging

Xing Chen Sheng Liu