Interfacial Reaction Between the Thermopile Materials and Eutectic Sn-Based Solders

摘要：

The indium-based solders and bismuth-based solders are commonly employed in soldering the thermopile. Since the wettability between bismuth telluride materials and low melting point alloy solders is poor, a nickel layer was employed on the surface of thermoelectric materials. In this study, in the atmospheric environment, the eutectic Sn-Bi and Sn-In solders spreaded on the p-type thermoelectric respectively without using soldering flux, the corresponding interfacial microstructures were indentified. The interfacial reaction is more sufficient under 300 ℃ when comparing to that under 250 ℃. In addition, a thin nickel layer was deposited on the thermoelectric unit by vapor deposition facility. However, a thin Ni-plated layer on thermoelectric materials might induce severe formation of cracks.

作者: Li Shen Guangchen Xu Ran Zhao Fu Guo

作者单位: College of Materials Science and Engineering, Beijing University of Technology

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 1172-1175

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）