Recent Progress in The Studies of Low Melting Sn-Based Pb-Free Solders

摘要：

Limited by the toxicity of Pb and Pb-containing compounds and the implementation of the mandatory legislations, such as WEEE and RoHS, the Pb-containing solders have been banned and accordingly the Pb-free solders have become popular in electronic industry. However, the novel developed Pb-free solders could cause a series of packaging defects such as delamination, cracking, and charring etc. due to the relatively high melting temperatures of these Pb-free substitutes compared to the former Sn-Pb

作者: Yang Lin Luqiao Yin Xicheng Wei

作者单位: Key Laboratory of Advanced Display and System Applications, Shanghai University, Ministry of Educati School of Mechatronics and Automation, Shanghai University, P.O.B.143, 149 Yanchang Rd., Shanghai 20 School of Mechatronics and Automation, Shanghai University, P.O.B.143, 149 Yanchang Rd., Shanghai 20

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 338-341

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）