Effects of Grooves Substrate on Thermal Interface for the LED Module
In a typical LED package module, a grease layer forms the interface between the substrate and copper heat spreader. We propose to carve grooves on the aluminum substrate to form an array of protruding posts. Three types of grooves are designed to measure interface thermal resistance. A preliminary feasibility study shows obvious improvement in the thermal resistance of the interfaces for the formation of thinner bond line thickness. Accelerating testing results in HS020 chamber also demonstrate improved reliability against grease pump-out with protruding posts surfaces.
Tao Peng Mingxiang Chen Xiaogang Liu Xiaobing Luo Sheng Liu
Institute for Microsystems, School of Mechanical Science and Engineering, Huazhong University of Sci Institute for Microsystems, School of Mechanical Science and Engineering, Huazhong University of Sci
国际会议
上海
英文
1098-1100
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）