Irregular Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0RE Solder Joints

摘要：

The morphology of tin whiskers on the surface of the oxidized RE-Sn phases was observed by SEM. The results show that, besides the regular pencil-shaped whiskers, chrysanthemum-type whisker; spiral whisker; plate-like whisker; whisker with a non-constant cross section; branch-type whisker and joint-type whisker were also found in this study. It is suggested that except for the special case, the stress state around the root of whisker and the supply of tin atoms together influence the morphology of tin whisker.

作者: Hu Hao Jun Tian Guangchen Xu Fu Guo Yonglun Song Yaowu Shi

作者单位: College of Materials Science and Engineering, Beijing University of Technology College of Mechanical Department of Materials Science and Engineering, Fujian University of Technology College of Materials Science and Engineering, Beijing University of Technology College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technolo

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 793-796

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）