The Impact of Wire Bonding on the Transmission Performance of High-Speed Links in SiP
Wire bonding is a primary method of making interconnection between an integrated circuit (IC) and a printed circuit board (PCB) during semiconductor device fabrication, which is generally considered as the most flexible and cost-effective interconnection technology, and is widely used in electric packaging. This paper focuses on the impedance mismatch problem caused by bonding wires. A variety of bonding wires with different characteristics in terms of diameter, loop span, loop height, and shape are studied in this paper. Additionally, the crosstalk between adjacent bonding wires is analyzed. All analysis is founded on the base of signal integrity theory and simulation with HFSS software.
Yang Kun Gao Wei li Zhihua Wan Lixi
Institute of Microelectronics, Chinese Academy of Sciences Lab 9, IMECAS, NO.3 Beitucheng West Rd., Chaoyang Dist., Beijing, China, 100029
国际会议
上海
英文
912-915
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）