LED Packaging Study by Tear-down Approaching

摘要：

LED lighting is quite important & next generation key approaches to Green solution with power saving. This presentation will show LED packaging trend information by LED product teardown approaching. LED lighting bulb lamp teardown: Japan & China products are introduced in the first part, together with study for LED packaging technology trend and study for design & quality control method. The key packaging technology issues for LED packaging are also shown, e.g., Wire & Die bonding, flip chip bonding, molding & encapsulation, substrate and analysis.

作者: T.ONISHI

作者单位: GJ Tech, HK, China

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 1

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）