Application of Silicon Stress Sensor in Flip Chip Packaging System

摘要：

Flip chip packaging system consists of different materials in the connecting parts, and has an undesirable stress distribution on the chips. Large residual strain will lead to a deterioration of the circuit performance, andresearchers are working to reduce the residual strain in the packaging system. In our work, a silicon stress sensor chip is fabricated to measure the stress distribution in flip chip packaging system, and four point bending method is used to calibrate the piezoresistance coefficients. The effects on residual strain caused by chip size, location, underfills, and the packaging process are tested, and a relationship between the parameters above and stress distribution is discussed.

作者: Chengjie Jiang Fei Xiao Heng Yang Chuanguo Dou

作者单位: Department of Materials Science, Fudan University 220 Handan Road, Shanghai 200433, China Shanghai Institute of Microsystem and Information Technology 800Yishan Road, Shanghai 200233 China

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 932-936

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）