会议专题

Employment of Sputtered Ni-Zn Films for Under Bump Metallization with Sn-3.0Ag-0.5Cu Solder Attached during Liquid Reactions

This study aims to investigate the feasibility of sputtered Ni-xZn films for application as the under bump metallization (UBM). The interfacial reaction under liquid reactions of Sn-3.0Ag-0.5Cu (SAC305) joints with Ni-Zn films will be evaluated. Various kinds of Ni-Zn films were fabricated by sputtering. The surface roughness and residual stress of the Ni-Zn film was evaluated using atomic force microscope (AFM) and the curvature technique. The X-ray diffractometry (XRD) was used to further identify the structure and phases in the films. Detailed morphology of the interfacial reaction in SAC305/Ni-xZn joints was performed by a field-emission scanning electron microscope (FE-SEM) with low angle backscattered electrons detector (LABE). Different structure growth in sputtered deposition might lead to distinct IMC formation. The microstructure evolution and phase formation in the SAC305/Ni-7Zn and SAC305/Ni-20Zn joints varied with reflow time. This study demonstrated that the binary Ni-Zn film might be a potential alternative for under-bump metallization application. In addition, the influence of Zn on Ni-Zn films UBM during liquid reactions was discussed and probed.

Hsiu-Min Lin Jenq-Gong Duh Su-Yueh Tsai

Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan,Chin Precision Instrument Center, National Tsing Hua University, Hsinchu, Taiwan,China

国际会议

2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

上海

英文

361-365

2011-08-08(万方平台首次上网日期,不代表论文的发表时间)