In Situ Measurement of Stress Evolution in Sn-Based Solder Joint under Electromigration Based on X-ray Diffraction Technique
The in-situ measurement of the stress evolution at the anode and cathode interfaces of the Cu/3.0Ag0.5Cu/Cu solder joints with current density of 4×103A/cm2 at room temperature by X-ray diffraction technique was investigated. The experimental results showed that the stress evolution at the interfaces was a very complicated process during current stressing, which owed to many influencing factors such as Joule heating effect, stress relaxation, electromigration force and so on. After current stressing, the whiskers and hillocks were formed at the interface of the anode side which was as a mode of relieving compressive stress. It was found that a uniform Cu6Sn5 intermetallic compound layer was formed at the anode interface after polishing the solder joint.
Hongwen He Haiyan Zhao Limin Ma Guangchen Xu Fu Guo
Department of Mechanical Engineering, Tsinghua University Material Science and Engineering, Beijing University of Technology
国际会议
上海
英文
768-771
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）