Advanced Epoxy Molding Compound Technology & Marketing Trend

摘要：

From through-hole discrete components to surface mount devices, requirements of todays semiconductor packaging materials become more demanding. This presentation gives an introduction of Henkel advanced epoxy molding compound from formulation step to manufacture process step which shows the outstanding performance of Henkel molding compound. Epoxy molding compound market trend and Henkel technology solution also will be introduced in this presentation.

作者: Tom XIE

作者单位: Henkel, China

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 1

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）