Advanced Epoxy Molding Compound Technology & Marketing Trend
From through-hole discrete components to surface mount devices, requirements of todays semiconductor packaging materials become more demanding. This presentation gives an introduction of Henkel advanced epoxy molding compound from formulation step to manufacture process step which shows the outstanding performance of Henkel molding compound. Epoxy molding compound market trend and Henkel technology solution also will be introduced in this presentation.
Tom XIE
Henkel, China
国际会议
上海
英文
1
2011-08-08(万方平台首次上网日期,不代表论文的发表时间)