会议专题

Experiments and Numerical Simulation on the Performance of LED Subjected to Thermal Shock

In this paper, in order to improve the reliability of LED module, the accelerated life test (ALT) for LED was conducted. Experimental measurements were adopted to obtain the temperature variations of LED module. In the experiment, the LED samples are placed in the chamber to conduct the thermal shock between -40℃ and 125℃. The powered and unpowered experiments of LED were both tested. The luminous efficiency of LED was tested as a function of time. It was found that some LED samples failed. Numerical simulation was used to obtain the thermal stress distribution of the LED modules. Base on the above experiments and simulations, failure mechanisms were analyzed. The most vulnerable position of LEDs was pointed out.

Xulong Gui Sheng Liu

Division of MOEMS, Wuhan National Laboratory for Optoelectronics, Wuhan, 430074, China Institute for Division of MOEMS, Wuhan National Laboratory for Optoelectronics, Wuhan, 430074, China Institute fo

国际会议

2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

上海

英文

899-902

2011-08-08(万方平台首次上网日期,不代表论文的发表时间)