Design and Reliability of Power Electronics Modules
For effective control of electricity, the most practical and efficient method is the use of modern power electronics. Nowadays, in applications such as green energy conversion and distribution, electric vehicles, automotives and aerospace, power electronics are ubiquitous. At the heart of power electronics devices are power electronics modules(PEMs): self-contained semiconductor packages that work at strong current and high voltage. Power electronics is a rapidly growing sector globally and it is finding its way into many new, and frequently very demanding applications. The environments where PEMs are used have become harsher and the requirement for their reliability has become higher which makes the design of PEMs a great challenge to the manufacturers. In this paper, the methods of design and reliability analysis of PEM are discussed. With a focus on the key packaging design issues such as solder joint and wire bond, the advantage of using computer simulation will be demonstrated and the impact of PEM design parameters such as solder thickness and wirebond diameter will be discussed. To conclude the paper, the development of a user-friendly design platform for PEMs will be described. The objective of this development is make the use of physics of failure based reliability analysis easier for design engineers. Instead of using full-blown Finite Element analysis method, surrogate models are used and when combined with statistical tools and cycle counting algorithms that are available in the platform, impact of design variations can be predict.
Hua LU
University of Greenwich, UK
国际会议
上海
英文
1
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）