Effect of Substrate Surface Treatment on the Bondability of Wire Bonding
Substrate is the main carrier of VLSI and high density IC package ，and it is very important for the whole IC assembly industry ，because the quality of substrate directly affect the manufacture of IC package and reliability ， especially the quality of substrate surface treatment. It is mainly discussed about the affection of substrates surface treatment for assembly process in the paper. It is indicated though the experiment that wire-bonding process is effected by the surface treatment, surface roughness and thickness of gold. And the thickness of gold is the important effect factor. The Ni/Au Plating treatment is better than ENEPIG treatment for wire-bonding process ， and the roughness has no effect on wire-bonding process.
Lingwen KONG
SCC, China
国际会议
上海
英文
1
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）