Development of a Three-dimensional Integrated Solder Ball Bumping & Bonding Method for MEMS Devices
Compared with integrated circuits, MEMS devices are more sophisticated and diverse. The complex non-planar micro components of MEMS devices raise the urgent needs for three-dimensional (3-D) packaging. To fulfill the specific needs in 3-D MEMS packaging, the basic concepts of a new 3-D integrated solder ball bumping & bonding method for MEMS devices was proposed. A prototype platform was developed according to the concepts with pads detection, micro solder ball manipulation, fluxless laser reflowing and bumps repairing processes. In the prototype platform, an improved center detection algorithm with the combination of the randomized Hough transform and the least squares method was integrated. The detecting tests indicated that the precision of the detecting algorithm can reach 0.21μm, and its computing time was less than 10ms.With further experiments verification, solder bumping and microsensors packaging experiments were carried out.
Lei Yang Wei Liu Chunqing Wang Yanhong Tian
State Key Lab of Advanced Welding and Joining, School of Materials and Engineering State Key Lab of Advanced Welding and Joining, School of Materials and Engineering Mechanical Engine
国际会议
上海
英文
729-732
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）