会议专题

第十九届国际电子封装技术会议(ICEPT 2018)

总文献量: 381篇会议类型: 国际会议会议地点: 上海主办单位: 中国电子学会;国际电气电子工程师协会;中科院会议日期: 2018-08-08

文章浏览

Hetero-connecting materials effect on the electromigration and thermalmigration of SnBi solder joints

Ming Liu Limin Ma Fu Guo Yishu Wang Jing Han

VUV/O3 activated bonder for low-temperature direct bonding of Si-based materials

Jikai Xu Chenxi Wang Xiaoyun Qi Bin Wu Shicheng Zhou Yanhong Tian

Design and implementation of semiconductor Laser reliability testing platform

Meng Su Guoguang Lu Huawei Xu Qi Peng Linyi Huang

Study of the interaction energy at the composite interface between PDMS and functionalized Graphene using molecular dynamics simulations

Kai Fan Kailin Pan Siming Gong Wenhui Wang HaoCheng ChenGuo

Simulation and Optimization of High Performance On-Chip Solenoid MEMS Inductor

Shengrui Zhou Ling Xu Jicun Lu Yinglin Yang

Study on Interfacial Diffusion Mechanism of The Nonstoichiometric ratio TiN0.3 and AlN composite in the process of sintering

ZhanWen He M Z Wang

Application of Finite Element Simulation Analysis and Calculation in Process Design Optimization

Yabing Zou Tao Lu Xiao He

A low-pass filter made up of the cylindrical through-silicon-via

Fengjuan Wang Jia Huang Ningmei Yu

Design and Fabrication of Silicon-cavity Band-pass Filters Based on MEMS Technology

Peng Dong Xiongwen Pan Zhidong Li Bin Duan Qi Li Qi Wang

Investigation on the Joule heat and thermal expansion in flip chip package by electro-thermo-mechanical coupling analysis

Zhan Liu Junhui Li Wenhui Zhu

Effect of electric current stressing on the shear strength and fracture behavior of micro-scale BGA structured Cu/Sn-3.0Ag-0.5Cu/Cu joints

Wen-Kai Le Xiang Ning Jia-Qiang Huang Min-Bo Zhou Xin-Ping Zhang

Facile way to fabricate high quality white LED with yellow graphene quantum dots

Jipeng Zhou Chunya Li Luqiao Yin Liang Wang Jianhua Zhang

Effect of electromigration on the microstructural evolution and shear fracture behavior of mixed assembled Cu/Sn-3.0Ag-0.5Cu-ball/Sn-58Bi-paste/Cu joints in board-level packaging

Jia-Qiang Huang Min-Bo Zhou Xin-Ping Zhang

A study on Pd distribution effect on the reliability of Au coated PCC wire bonding

SeokHo Na SungHo Jeon

Room temperature GaN bonding by surface activated bonding methods

Fengwen Mu Tadatomo Suga

Batch-Mode μUSM Process for Surrounding Air Cavity and TCV Holes of AlN Ceramic Substrate Application for Patch Antenna

Yanming Xia Shenglin Ma Lu Song Tao Wang Zetian Wang Xuanyang Li Jing Chen Yufeng Jin Wei Wang

Challenges in Predicting the Solder Interconnect Lifetime of High Power Electronics

X.Zhao Hans de Vries Piet Watte Ger van Hees

Compensation Method for Die Shift in Fan-Out Packaging

Yue Sun Fengze Hou Feng Chen Haiyan Liu Hengyun Zhang Peng Sun Tingyu Lin Liqiang Cao

The impact of bumping stress on Cu RDL structure

Yulong Xie Liming Gao

Synthesis of size-controlled pure copper nanoparticles for packaging interconnect

Tao Lai Yu Zhang Chengqiang Cui Kai Zhang Tao Chen Xun Chen Xin Chen Jian Gao Yunbo He Hui Tang Yun Chen