A low-pass filter made up of the cylindrical through-silicon-via

摘要：

　　the concept of three-dimensional integrated circuits has been widely practiced in many fields such as SoC(system on chip)DSP(image signal processor).It is well-known that through-silicon-via(TSV)has not only been used as interconnection between vertical layers but been applied to more fields like radio frequency(RF).In this paper,a low-pass filter(LPF)based on the cylindrical TSV consists of two planar spiral inductors and one TSV capacitor.The simulation result shows that the cutoff frequency is about 20GHz and the area is only 10850 um2.

关键词： Three-dimensional integrated circuits (3D IC) through-silicon-via (TSV) low-pass filter

作者: Fengjuan Wang Jia Huang Ningmei Yu

作者单位: School of Automation and Information Engineering Xian University of Technology Xian,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 257-259

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）