Effect of electric current stressing on the shear strength and fracture behavior of micro-scale BGA structured Cu/Sn-3.0Ag-0.5Cu/Cu joints

摘要：

　　Shear performance and fracture of BGA structured Cu/Sn–3.0Ag–0.5Cu(SAC305)/Cu joints under current stressing were characterized.Solder joints undergoing electric current stressing have lower shear strength,and fracture tends to take place near the interface between the solder and the intermetallic compound(IMC),and shear fracture strength of the joints decreases with increasing current density.In addition,under electric current stressing,fracture largely occurred mainly by mixed ductile-brittle mode.The temperature of the joints increases greatly upon applying electric current as confirmed by finite element simulation(FE simulation),which is induced by the Joule heating effect.Moreover,the phenomenon of local melting has been observed in solder joints with electric current stressing.

关键词： BGA joint shear strength fracture behavior electric current stressing finite element simulation

作者: Wen-Kai Le Xiang Ning Jia-Qiang Huang Min-Bo Zhou Xin-Ping Zhang

作者单位: Lab of Smart Materials and Electronic Packaging in School of Materials Science and Engineering,and Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability,South China University of Technology,Guangzhou 510640,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 610-614

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）