Synthesis of size-controlled pure copper nanoparticles for packaging interconnect
Copper nanoparticles used in microelectronic packaging industry are being given great attractive interest for its excellent power-handling capacity,high-thermal conductivity and reliability.In this article,we describe a route to synthetize pure,stable,monodisperse and size-controlled copper nanoparticles for microelectronic packaging use.In this work,copper nanoparticles were synthesized by reducing bivalent copper ions of copper acetate with ascorbic acid through a liquid phase reduction method,poly(N-vinylpyrrolidone)(PVP)was used as the protective agent.The size of copper nanoparticles can be controlled between 30nm and 80nm,and the produced copper nanoparticles were confirmed metallic copper with the formation of face-centered cubic(fcc).In this paper,we evaluated the influence in particle size by vary the reaction temperature,molar ratio of copper acetate to PVP concentration,optimum conditions were obtained through lots of experiments.
copper nanoparticle high dispersity sizecontrolled
Tao Lai Yu Zhang Chengqiang Cui Kai Zhang Tao Chen Xun Chen Xin Chen Jian Gao Yunbo He Hui Tang Yun Chen
School of Electromechanical Engineering,Guangdong University of Technology,Guangzhou,P.R China
国际会议
上海
英文
1702-1705
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）