Investigation on the Joule heat and thermal expansion in flip chip package by electro-thermo-mechanical coupling analysis
As the feature size of flip chip(FC)decreasing,the chip power increasing rapidly.Joule heat in the circuit will cause the temperature to rise and lead to thermal expansion in the FC package assembly.Therefore,the reliability of FC package under the electro-thermo-mechanical coupling interaction should be deeply investigated.In this paper,the electro-thermo-mechanical coupling analysis of the reliability of FC package was performed by finite element simulations.Taking into account the temperature dependence of the resistivity,the traces,pads,and solder bumps were analyzed using linearized resistivity.Firstly,the 3D finite element model of the FC package system was established.Then,the Joule heat and thermal expansion in flip chip were analyzed by thermal-electric-mechanic coupling method.Thus,the current density and temperature distribution were obtained,at the same time,the thermal stress and deformation were also analyzed.Moreover,the effects of current,operating temperature,and underfill material properties on Joule heat and thermal expansion in flip chip were deeply analyzed.This research work provides important guidance for the reliability design of flip chip.
Flip chip Coupling analysis Reliability Numerical simulation
Zhan Liu Junhui Li Wenhui Zhu
State Key Laboratory of High Performance Complex Manufacturing and School of Mechanical and Electrical Engineering Central South University Changsha,China
国际会议
上海
英文
1133-1136
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）