Application of Finite Element Simulation Analysis and Calculation in Process Design Optimization

摘要：

　　In this study,a failed power supply chip was used as example to solve the problem of external stress(mainly for temperature cycle)cracking of solder joints through the change of the PCB pad design.In addition,through the finite element numerical simulation analysis and calculation method,the life of QFN solder joints before and after optimization was evaluated,and the effective evaluation level quantified the effect of optimization and improvement.

关键词： Finite Element Method Finite Element Simulation Analysis (FEA) Process Design Optimization

作者: Yabing Zou Tao Lu Xiao He

作者单位: The Reliability Research and Analysis Center(RAC),China CEPREI Laboratory(the 5th Electronics Research Institute of the Ministry of Industry and Information Technology of China)Guang Zhou,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 691-695

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）