会议专题

The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

总文献量: 363篇会议类型: 国际会议会议地点: 成都主办单位: 中国电子学会会议日期: 2014-08-12

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Effects of Residual Stress in the Membrane on the Performance of Surface Micromachining Silicon Nitride Pressure Sensor

Hao Jiang Gang Cao Chunlin Xu Zefeng Zhang Sheng Liu

Parallel Gap Resistance Thick Wire Bonding for Vertical Interconnection in 3D Assembly

Xuguang Guo Yanhong Tian Shang Wang Chunqing Wang

Research on Reliability of Sn-1.0Ag-0.5Cu Low-Ag Lead-free Solder Alloy

Yating Hu Bing An Rong Chen Weiwen Lv Yiping Wu

Experimental and Numerical Study of Moisture Effect on Warpage of Plastic Package

Yinglei Chen Maohua Du Jianwei Zhou Tae Sub Chang

Harmonic Vibration Analysis and S-N Curve Estimate of PBGA Mixed Solder Joints

Lu Tao Zhou Bin Pan Kailin En Yunfei Gong Yubin

Effect of Al-0.5%Cu thin film on reliability of IGBT module

Wen Zhao Yong Wang Ming Li Liming Gao

Microstructures and Properties of Alumina/Copper Joints Fabricated by Ultrasonic-Assisted Brazing for Replacing DBC in Power Electronics Packaging

Hongjun Ji Hao Chen Mingyu Li

Study on the board-level drop test of the stacked memory device by FEA

Junwen Pang Jun Wang Liyou Zhao

Reliability of 1206 capacitor/SAC305 solder joint reflowed in protective atmosphere

Yeqing Tao Dongyan Ding Ting Li Jason Guo Ted He Yunhong Yu

Failure Analysis of Sm2Co17 Type Permanent Magnet for High Temperature

Yan Yao Shengxiang Bao Zhang Xiaowen Wang Zuwen Shen Anguo Zhang Ming

Study on the bridge effect of Graphene oxide on thermal conductivity of Al2O3 filled glass fibers reinforced polymer composites

Yimin Yao Xiaoliang Zeng Rong Sun Jianbin Xu

band-notched UWB antenna with good shape factor

Nie Fan Jin Long

The influence of the solder joint void on the CCGA package reliability

Yingzhuo Huang Binhao Lian Quanbin Yao Xiaorui Lv Pengrong Lin

Palladium Coated Cu Wire:A Robust Material for Die to Die Cu WB Interconnect

Allen M.Descartin Zhang XiaoLong Li Jun

Low Cost Fabrication of TSV-based Silicon Interposer Using Wet Chemical Etching and Its Application in 3D Packaging

Jiaotuo Ye Xiao Chen Chunsheng Zhu Le Luo Gaowei Xu

Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application

Janusz Sitek Marek Koscielski Yan Zhang Jing-yu Fan Shiwei Ma Johan Liu

Secondary optical design of LED lamps with high CRI and adjustable CCT

Keming Zeng Yujie Li Jin Chang Chunjin Hang Chunqing Wang

Reactive ion etching characteristics of partially-cured benzocyclobutene

Yang Yang Zhen Song Yuxin Du Zheyao Wang

Fine Pitch BGA Device Solder Bridging Mechanism Investigation Through Solder Shape Modeling

Xiaoqing Li Yuchuan Wang Jianwei Zhou Tae Sub Chang

Study on the Verification of IR and RTD Methods Applied in the Thermal Measurement of High Power Chips

Yan Zhang Chu-yun He Yong Zhang Yifeng Fu Jing-yu Fan Johan Liu