Parallel Gap Resistance Thick Wire Bonding for Vertical Interconnection in 3D Assembly

摘要：

　　This paper manages to obtain the technological parameter by studying the parallel gap resistance bonding of thick wire.Then the connection mechanism of copper and nickel wire on the tin coated copper solder is explored.Thirdly,the temperature field distribution during the process of bonding is also achieved by building the three-dimensional heat transfer model based on ANSYS software.The results indicate that bonding current and bonding time have the greatest influence on the joint strength,and the influence of electrode pressure takes the second place,while electrode spacing has the least influence on it.With the increasing of bonding current and bonding time,the joint strength increases.The bonding essence between Ni wire and Cu pad with Sn film is diffusion welding.There is a very thin layer of Sn under two electrodes which contributes to diffusion.With a higher temperature between the two electrodes,the diffusion is also obvious.The results of ANSYS simulation indicate that the temperature under the two electrodes hasnt reached the melting point of copper wire,which verifies the essence of the parallel gap resistance welding is not fusion welding.

关键词： parallel gap resistance bonding process parameter bonding mechanism temperature field simulation

作者: Xuguang Guo Yanhong Tian Shang Wang Chunqing Wang

作者单位: State Key Laboratory of Advanced Welding and Joining Harbin Institute of Technology(HIT),Harbin,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 6-9

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）