会议专题

Research on Reliability of Sn-1.0Ag-0.5Cu Low-Ag Lead-free Solder Alloy

  The main objective of this paper is to investigate the reliability of Sn-1.0Ag-0.5Cu low-Ag lead-free solder alloy.The wettability,mechanical property and microstructure of Sn-1.0Ag-0.5Cu(SAC105)and Sn-3.0Ag-0.5Cu(SAC305)lead-free solder alloys were comparatively investigated.Experimental studies have shown that the wetting property of low-Ag lead-free solder alloy SAC105 remains to be improved and mechanical strength is lower to SAC305,but its anti-drop and anti-shock performance are outstanding.Though the wetting property of SAC105 is inferior to SAC305,the melting point and wettability of SAC105 can meet the actual reliability requirements of products.Matched with appropriate process,low-Ag lead-free solder can also form reliable solder joints to meet the reliability standards in industrial production.

lead-free solder low-Ag SAC105 reliability

Yating Hu Bing An Rong Chen Weiwen Lv Yiping Wu

School of Materials Science and Engineering Huazhong University of Science and Technology Wuhan,China

国际会议

The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

成都

英文

401-404

2014-08-12(万方平台首次上网日期,不代表论文的发表时间)