Experimental and Numerical Study of Moisture Effect on Warpage of Plastic Package

摘要：

　　In this paper,the moisture effect on the warpage of plastic package is studied through experimental and numerical method.Many investigations have proved that polymer materials can expand after absorbing moisture.And coefficient of moisture expansion(CME)is proposed to quantitatively describe polymer expansion caused by moisture.The plastic package consists of epoxy molding compound(EMC)and PCB,both of which can easily absorb moisture.Since different amounts of moisture absorption in different materials can lead to different expansions,warpage of plastic package can change after moisture absorption,even when the temperature keeps constant.Both the warpage and moisture are monitored during a series of processes.And the results show similar changing trend.The CME of EMC and BT core is tested through TGA/TMA method.It is found that the CME increases with temperature.Moisture diffusion simulation is used to determine the moisture concentration change of EMC and BT core during the ambient storage.The results combined with CME are used to calculate the warpage change caused by moisture during the ambient storage.The simulation results agree with the experiments,verifying the moisture effect on warpage.

关键词： moisture effect warpage change plastic package coefficient of moisture expansion(CME) TGA/TMA method numerical analysis

作者: Yinglei Chen Maohua Du Jianwei Zhou Tae Sub Chang

作者单位: Package Technology Development Team Samsung Semiconductor(China)R&D CO.,LTD Suzhou,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 801-805

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）