Reliability of 1206 capacitor/SAC305 solder joint reflowed in protective atmosphere
Electronic assembly technology is in the transition from traditional tin-lead to lead-free.In comparison with Sn-Pb solders,high melting point and poor wettability of the lead-free solders lead to great challenge in many aspects.It has been accepted that inert N2 atmosphere can improve the wettability and reliablity of solder joints.The focus of this study is to investigate the reliability of 1206 capacitor/SAC305 solder joint reflowed in N2 atmosphere with dilute oxygen.Reflow process in N2 atmospheres with dilute oxygen was conducted for OSP-pad PCBs.The wetting behavior during reflow was in-situ observed with SMT microscope.Visual inspection through optical microscope and microstructural characterization of the solder joints after both reflow process and environmental tests were carried out.The experimental results indicated that N2 atmosphere could obviously improve the wetting performance and reliability of solder joints in comparison with the solder joint fabricated in air atmosphere.
lead-free reflow N2 atmosphere reliability
Yeqing Tao Dongyan Ding Ting Li Jason Guo Ted He Yunhong Yu
Institute of Microelectronic Materials & Technology,School of Materials Science and Engineering,Shan Air Liquide China Shanghai 200233,China
国际会议
The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)
成都
英文
1026-1029
2014-08-12(万方平台首次上网日期,不代表论文的发表时间)