Study on the Verification of IR and RTD Methods Applied in the Thermal Measurement of High Power Chips

摘要：

　　In the present paper,a chip with a Pt-based RTD that functions as a heater and sensor is tested under serial power loads,and infrared(IR)thermal imaging system is adopted to obtain the thermal measurement.Comparisons of the hotspot temperatures of the chip obtained by RTD and IR methods have been made,where different surfaces of the chip were observed by the IR camera.Combing with the heat conduction law,the IR results of the test chip with surface preparation showed quite a good agreement with the RTD data,verifying the validation of the IR analysis method.

关键词： thermal measurement IR RTD

作者: Yan Zhang Chu-yun He Yong Zhang Yifeng Fu Jing-yu Fan Johan Liu

作者单位: SMIT Center,School of Mechatronics Engineering and Automation & Key Laboratory of Advanced Display a SHT Smart High Tech AB Gothenburg,Sweden Shanghai Institute of Applied Mathematics and Mechanics Shanghai University Shanghai,China SMIT Center & Bionano Systems Laboratory,Department of Microtechnology and Nanoscience Chalmers Univ

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 1507-1511

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）