Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application

摘要：

　　The results of investigations of new compositions of electrically conductive adhesives(ECA)for printed electronics applications with and without nano-additives are presented.The studies covered the influence of nano additives on mechanical properties and reliability of interconnects made by elaborated,improved composition of the ECA based on primary conclusions.The obtained results showed that nano additives influence significantly and positively on mechanical properties of ECA joints,but their impact on the reliability properties of joints manufactured in low temperatures is much lower or even negative.

关键词： Electrically conductive adhesives nano additives mechanical properties reliability of interconnects printed electronics

作者: Janusz Sitek Marek Koscielski Yan Zhang Jing-yu Fan Shiwei Ma Johan Liu

作者单位: Tele and Radio Research Institute Warsaw,Poland Shanghai University,Shanghai 200072,China Chalmers University of Technology,SE-412 96 Gothenburg,Sweden

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 151-154

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）